Custom X-Ray Imaging
Custom X-Ray Imaging
Embedded Files
On-site X-Ray equipment:
On-site X-Ray equipment:
60 kV voltage tube
100 μm focal spot effective imaging resolution
Focus Areas:
Focus Areas:
Board verification (verify BGA component soldering process integrity)
Reverse engineering (non-destructive hardware analysis at every PCB layer)
Counterfeit component detection
PCB Board Verification Capabilities:
PCB Board Verification Capabilities:
solder defect detection (bridge, voids)
component misalignment detection
bond wire defect detection
soldering irregularity detection (incorrect solder amount or wrong solder type)
PCB trace verification (short or improper opens)
PCB integrity verification (hidden board delamination or cracks)
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